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Advanced Tools for Testing, Measurement, and Industrial Instrumentation

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6 new products found

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952-1001

KAI Inference Builder

The KAI Inference Builder Bundle includes two agents and up to 100 prompts per second (1-year subscription, floating worldwide). The bundle is TAA Compliant.

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952-1010

KAI Inference Builder

The KAI Inference Builder Bundle includes 10 agents and up to 1000 prompts per second (1-year subscription, floating worldwide). The bundle is TAA Compliant.

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952-1100

KAI Inference Builder

The KAI Inference Builder Bundle includes 10 agents and up to 10,000 prompts per second (1-year subscription, floating worldwide). The bundle is TAA Compliant (952-1100).

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LN2CNFV001

Cloud-Native Function Test

Validate 5G cloud-native network function resiliency with automated testing that correlates CNF impairments to service-level KPIs in real time.

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LN2CNIB003

Cloud-Native Function Test

Benchmark CPU, memory, storage, and networking performance across Kubernetes clusters to validate infrastructure readiness before CNF deployment.

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DS2210A

Software

Detect, localize, and mitigate side-channel leakage before tape-out. Inspector SC2 Pre-Silicon Side-Channel Analysis enables hardware security, design, and verification teams to identify side-channel vulnerabilities during design phase and development, before silicon is manufactured (pre-silicon). While traditional post-silicon testing can determine whether leakage exists in a fabricated device, Inspector provides visibility into where leakage originates within the design, helping teams identify the root cause and evaluate mitigation strategies earlier in the development lifecycle. By analyzing register-transfer level (RTL), synthesized netlist, and gate-level designs using simulation test vectors and Value Change Dump (VCD) files, Inspector SC2 Pre-Silicon Side-Channel Analysis identifies which signals leak, how much they leak, when leakage occurs, and where it originates within the design. This visibility enables teams to validate countermeasures, compare design alternatives, and reduce the cost and risk of discovering vulnerabilities after fabrication.

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