Keysight’s E9905G supports up to 2592 nodes, Series 6 executes digital testing up to 4x faster while the overall physical footprint is 38% smaller.
| Fixture actuation | Vacuum |
| Maximum node count | 2592 |
| System width | 954 mm |
| Maximum parallel testing | 2 |
Detects a wide range of structural defects, such as solder opens, shorts, and incorrect component placement, ensuring improved product quality and reduced rework costs.
Supports high-density boards with flexible pin-count configurations, allowing adaptation to various board sizes and complexities without changing hardware.
Provides real-time test metrics, deep data insights, and automated reporting directly on the tester. Enables faster root-cause analysis, improves productivity on complex boards, and supports seamless scaling to enterprise-level analytics.
Performs structural diagnostics through standard test access ports (TAPs), eliminating the need for intrusive probing or additional hardware instrumentation.
| System width | 800 mm to 1800 mm |
| Maximum node count | Maximum parallel testing |
| Fixture actuation | Vacuum, Press down |
Keysight’s E9905G supports up to 2592 nodes, Series 6 executes digital testing up to 4x faster while the overall physical footprint is 38% smaller.
Keysight’s family of i3070 Series 6 In-Circuit Test (ICT) systems are built on a proven technology foundation, and they improve test efficiency with time-tested software, hardware, and programmability. I3070 Series 6 ICT tester supports a wide range of printed circuit board assembly (PCBA) sizes for applications including IoT and 5G, as well as automotive and energy. The i3070 features a unique design that delivers the shortest signal path between measurement circuitry and devices under test to minimize undesired effects from parasitic capacitance, improve immunity to crosstalk, and eliminate stray signal coupling effects, delivering consistent and repeatable measurements. The Series 6 is fully backward compatible with previous systems and makes highly repeatable measurements.
| i3070 Series 6 ICT offers customers: | Improved test efficiency with >40% faster Silicon Nails / Boundary-Scan testing and >6% faster overall testing on most PCBAs |
| 100% backward compatibility guarantees minimal downtime for installation and complete code compatibility | Certified machine-to-machine (M2M) capabilities such as IPC Connected Factory Exchange (IPC-CFX) and IPC-HERMES-9852 standards offer increased operation efficiency, greater test data insights, shorter response times, and reduced operating expenses. |
| Modern software licensing demystifies license costs, centralizes license management, and scales to meet production demand. | The new i3070 Series 6 in-circuit test platform provides transportable test capabilities and adds advanced Industry 4.0 technology to deliver high yield, fast throughput, and operational efficiency for our top-tier printed circuit assembly manufacturing customers. |
Max node count: 2592
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