Collection:

Electrical Structural Tester

Non-Destructive Electrical Structural Testing for Wire Bonds

Accurately detect subtle wire bond defects

Model:

Q3800A

N/A

Electrical Structural Tester

Discover a nondestructive capacitive-based testing solution that accurately identifies defects in wire-bonded microelectronics.

Test types Single Die Wire-Bonded Packages
System width 700 mm to 1,430 mm
Maximum parallel testing 4 to 20 sites

Non-destructive Electrical Structural Testing For Wire Bonds

The Keysight s8050 Electrical Structural Tester is a non-destructive, capacitive-based test solution designed to detect wire bond defects in integrated circuit (IC) packages. Using nano Vectorless Test Enhanced Performance (nanoVTEP) technology and Part Average Testing (PAT), the s8050 identifies subtle structural defects without powering the device under test. It is commonly deployed in post-mold IC assembly processes to verify wire bond integrity prior to final test, helping manufacturers reduce escapes, minimize rework, and improve overall yield. Request a quote or order one of our popular configurations today. Need help selecting? Check out the resources below.

High Parallelism With Scalable Architecture

Supports up to 20 parallel test sites using multiple VAM+ and nanoVTEP conditioner cards. This scalable design enables flexible system expansion while delivering high-throughput testing of up to 72,000 units per hour.

Detection Of Subtle Wire Bond Defects

Identifies a wide range of wire bond defects, including near-shorts, stray wires, wire sweep, and wire sag. Enables early detection of latent issues that can impact downstream yield and long-term reliability.

Non-Destructive Inspection

Evaluates wire bond presence and orientation using nanoVTEP capacitive sensing with low-level electrical stimuli. This approach avoids physical or electrical stress on the DUT, making it ideal for post-mold IC assembly.

Deviation detection with Part Average Testing (PAT)

Uses dynamic PAT for strip testing and real-time PAT for singulated devices to maintain accurate baselines. Adaptive limits reduce false rejects, minimize scrap, and lower retesting requirements.

System width 700 mm to 1,430 mm
Maximum parallel testing 4 to 20 sites
Test types Single Die Wire-Bonded Packages

Discover a nondestructive capacitive-based testing solution that accurately identifies defects in wire-bonded microelectronics.

Innovative solutions for identifying wire bond defects

The Keysight electrical structural tester is a capacitive-based testing solution designed to identify wire bond defects accurately. Leveraging the advanced part average test (PAT) analysis, the tester establishes a baseline from known-good units to swiftly detect deviations like near-shorts, stray wires, wire sweeps, and sags within integrated circuits (ICs). This capability ensures robust product quality management and significantly enhances manufacturing efficiency. The electrical structural tester enables you to:

Test single-die wire bonded packages in singulated or strip-based form factor. Achieve high-volume production with up to 20 parallel test sites, achieving up to 72,000 IC units per hour (UPH).
Enhance yield through advanced methods like marginal retry test (MaRT), dynamic part averaging test (DPAT) and real-time part averaging test (RPAT).

Service and Support

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Financial Alternatives

Get predictable, lease-based subscriptions and full lifecycle management solutions—so you reach your business goals faster.

Keysight Support Portal

Experience elevated service as a KeysightCare subscriber to get committed technical response and more.

Calibration

Ensure your test system performs to specification and meets local and global standards.

Education

Make measurements quickly with in-house, instructor-led training, and eLearning.

Software Download Center

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