Accurately detect subtle wire bond defects
Discover a nondestructive capacitive-based testing solution that accurately identifies defects in wire-bonded microelectronics.
| Test types | Single Die Wire-Bonded Packages |
| System width | 700 mm to 1,430 mm |
| Maximum parallel testing | 4 to 20 sites |
Supports up to 20 parallel test sites using multiple VAM+ and nanoVTEP conditioner cards. This scalable design enables flexible system expansion while delivering high-throughput testing of up to 72,000 units per hour.
Identifies a wide range of wire bond defects, including near-shorts, stray wires, wire sweep, and wire sag. Enables early detection of latent issues that can impact downstream yield and long-term reliability.
Evaluates wire bond presence and orientation using nanoVTEP capacitive sensing with low-level electrical stimuli. This approach avoids physical or electrical stress on the DUT, making it ideal for post-mold IC assembly.
Uses dynamic PAT for strip testing and real-time PAT for singulated devices to maintain accurate baselines. Adaptive limits reduce false rejects, minimize scrap, and lower retesting requirements.
| System width | 700 mm to 1,430 mm |
| Maximum parallel testing | 4 to 20 sites |
| Test types | Single Die Wire-Bonded Packages |
Discover a nondestructive capacitive-based testing solution that accurately identifies defects in wire-bonded microelectronics.
The Keysight electrical structural tester is a capacitive-based testing solution designed to identify wire bond defects accurately. Leveraging the advanced part average test (PAT) analysis, the tester establishes a baseline from known-good units to swiftly detect deviations like near-shorts, stray wires, wire sweeps, and sags within integrated circuits (ICs). This capability ensures robust product quality management and significantly enhances manufacturing efficiency. The electrical structural tester enables you to:
| Test single-die wire bonded packages in singulated or strip-based form factor. | Achieve high-volume production with up to 20 parallel test sites, achieving up to 72,000 IC units per hour (UPH). |
| Enhance yield through advanced methods like marginal retry test (MaRT), dynamic part averaging test (DPAT) and real-time part averaging test (RPAT). |
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